Super X13SAN-C-WOHS, Celeron® 7305E, VGA, HD Audio/HDMi, 2x 2.5GB LAN, 1x SATA3, DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-E,12th Gen Core i5-1245UE,VGA,PCI4 SlimSAS,2x 2.5GB LAN,1x SATA3,M.2,DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-E-WOHS,12th Gen Core i5-1245UE,VGA,PCI4 SlimSAS,2x 2.5GB LAN,1x SATA3,D5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-H, Celeron® i7-1265UE, VGA, HD Audio/HDMi, 2x 2.5GB LAN,1x SATA3,M.2,DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-H-WOHS,Celeron® i7-1265UE,VGA,HD Audio/HDMi, 2x 2.5GB LAN,1x SATA3,M.2,D5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-L,12th Gen Core i3-1215UE,VGA,HD Audio/HDMi,2x2.5GB LAN,1x SATA3,M.2,DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAN-L-WOHS,12th Gen Core i3-1215UE,VGA,HD Audio/HDMi,2x2.5GB,1xSATA3,M.2,DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 64 EU with Intel® UHD graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SAW-F,14th/13th Gen i9/i7/i5/i3 LGA-1700,WIO,2xPCIe,VGA,2xGB LAN,4xSATA3+R,IPMI,D5(128GB)
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Key Features 14th/13th/12th Generation Intel® Core¿ i9/i7/i5/i3/Pentium/Celeron Processor, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP Intel® R680E Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR5-4400MHz, in 4 DIMM slots 1 PCIe 5.0 x16 slot, 1 PCIe 4.0 x4 slots, 2 PCIe 4.0 x4 MCIO 1 M.2 M-Key 2280 (PCIe 3.0 x4) 1 M.2 M-Key 2280/22110 (PCIe 4.0 x4) Dual 2.5 Gigabit LAN with Intel® Ethernet i226 LAN controller Intel® R680E Controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Super X13SAW-TLN4F,14th/13th Gen i9/i7/i5/i3 LGA-1700,WIO,2xPCIe,VGA,4xGB,4xSATA3+R,IPMI,D5(128GB)
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Key Features 14th/13th/12th Generation Intel® Core¿ i9/i7/i5/i3/Pentium/Celeron Processor, Single Socket LGA-1700 supported, CPU TDP supports Up to 125W TDP Intel® R680E Up to 128GB Unbuffered ECC/non-ECC UDIMM, DDR5-4400MHz, in 4 DIMM slots 1 PCIe 5.0 x16 slot, 1 PCIe 4.0 x4 slots, 2 PCIe 4.0 x4 MCIO 1 M.2 M-Key 2280 (PCIe 3.0 x4) 1 M.2 M-Key 2280/22110 (PCIe 4.0 x4) Dual 2.5 Gigabit LAN with Intel® Ethernet i226 LAN controller, Dual 10 Gigabit LAN with Intel® Ethernet X550-AT2 LAN controller Intel® R680E Controller for 4 SATA3 (6 Gbps) ports; RAID 0,1,5,10 2 Independent Display Ports (2 DP1.4) Supports 12V DC power input
Super X13SEI-F, 4th Gen 1x LGA-4677, 5x PCI5.0, VGA, 2x GB/i210, 10x SATA3, 4x NVMe, IPMI, DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16, M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 1GbE with Intel® I210 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEI-TF, 4th Gen 1x LGA-4677, 5x PCI5.0, VGA, 2x 10GB/X550, 10x SATA3,4x NVMe,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16, M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 10GbE with Intel® X550 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEM-F, 4th Gen 1x LGA-4677, 3x PCI5.0, VGA, 2x GB/i350, 10x SATA3, 4x NVMe, IPMI, DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s) M.2 Interface: 2 PCIe 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors Dual LAN with 1GbE with Intel® I350 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports
Super X13SEM-TF, 4th Gen 1x LGA-4677, 3x PCI5.0,VGA,2x 10GB/X550,10x SATA3,4x NVMe,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s) M.2 Interface: 2 PCIe 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors Dual LAN with 10GBase-T with Intel® X550 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports
Super X13SEW-F,4th Gen 1x LGA-4677, WIO,2x PCI5.0,VGA,2xGB/i210,10xSATA3,10xNVMe,M.2,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8 ( in x16) 1 PCIe 5.0 x32 M.2 Interface: 1 PCIe 3.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors Dual LAN with 1GbE with Intel® I210 2 SuperDOM with built-in power I/O: 1 VGA, 2 COM, 1 TPM header 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEW-TF,4th Gen 1x LGA-4677,WIO,2x PCI5.0,VGA,2x10GB/X550,10xSATA310xNVMe,M.2,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8 ( in x16) 1 PCIe 5.0 x32 M.2 Interface: 1 PCIe 3.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors Dual LAN with 10GBase-T with Intel® X550 2 SuperDOM with built-in power I/O: 1 VGA, 2 COM, 1 TPM header 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SRA-TF,W-2400 & W3400/LGA-4677,3xPCI5.0,VGA,HD Audio,1xGB+1x10GB,6xSATA3+R,2xM.2+R,D5(2TB)
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Key Features Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W Intel® W790 Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots 3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards 1 PCIe 4.0 x4 Slots M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Socket (w/o heat sink) 1GbE LAN port with Intel® Ethernet Controller I210-AT
Super X13SRN-E, i5-1350PE, VGA, HD Audio/HDMi, 2x 2.5GB LAN, 1x SATA3, 3x M.2, DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SRN-H, i7-1370PE, VGA, HD Audio/HDMi, 2x 2.5GB LAN, 1x SATA3, 3x M.2, DDR5(64GB) SODIMM
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Key Features First performance hybrid architecture from Intel 4 independent display with 4K resolution Fast AI hardware acceleration Up to 96 EU with Intel® Iris® Xe graphics capable of 4K60 resolution Next gen interfce: DDR5-4800 MHz and PCIe Gen4 x4 by SlimSAS and M.2 High speed connectivity through dual 2.5GbE 100% wide temp grade design and components applied 12-24V wide range power with RVP and TVS Rich I/O and expansion: 4 COM, 9 USB, audio with AMP, triple M.2 Hailo-8¿ powerful and efficient Edge AI solution integration ready
Super X13SWA-TF,W-2400&W3400/LGA-4677,6xPCIe5,VGA,HD Audio,1xGB+1x10GB,8xSATA+R,2xM.2+R,IPMI,D5(2TB)
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Key Features Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Up to 350W TDP Intel® W790 Up to 4TB(W-3400)/2TB(W-2400) 3DS ECC RDIMM, 1TB(W-3400)/512GB(W-2400) ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), in 16 DIMM slots M.2 Interface: 4 PCIe 5.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Socket (w/o heat sink) Xeon® W-3400 Series Processors: 6 PCIe 5.0 x16 Slots, support up to 6 Single Width/4 Double Width/2 Triple Width GPU cards Xeon® W-2400 Series Processors:3 PCIe 5.0 x16 Slots, support up to 3 Single Width/3 Double Width/2 Triple Width GPU cards (slot 3/5/7)
Super X14SBM-TF, Xeon 6700E/LGA-4710,3xPCIe 5.0,VGA,2x10GB/X710,2xSATA3,2xM.2,IPMI,COM,TPM2,,D5(1TB)
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Key Features Intel® Xeon® 6700E-series processors, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots 4 PCIe 5.0 X8 via MCIO connectors 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, M.2 Interface: 2 PCIe 5.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 10GBase-T with Intel® X710-AT2 Onboard TPM2.0 4 USB 3.2 Gen1 (2 rear, 2 via header), 2 SATA3 ports