In-Win BT566T, Black Slim Desktop, 1x 5.25"/1x 3.5" Ext + 1x 3.5" Int Bays, 300W P.S
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Specification * Mfr Part Number: IW-BT566T.300BL * Features: o CAG 1.1 (TAC) Prescott ready o Material: Best Performed SECC Japanese Steel metal. o 0.8 mm Sheet Metal Construction - for better stability & durability. o Small form factor design. o Fascinate Design with Footstand can be set in vertical way. o Standard 80mm Case Fan o All Drive Cages are Detachable - for better install and service. o Folded Edge - for safety installation. No sharp edges, debris. o Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. o Meet CE, FCC Class B requirement. * Case Type: Mini Desktop * Color: Black * Material: 0.8 mm Best Performed SECC Japanese Steel metal * M/B Type: Micro-ATX * Drive Bays: 3 o External Bay: 1x 5.25", 1x 3.5" o Internal Bay: 1x 3.5" * Expansion Slots: 4 * Cooling System: Standard 80mm Case Fan, Increased air duct * Side Windows: No * Front I/O Panel: 2x USB 2.0, 1x Speaker, 1x Mic-in * Power Supply: TFX 12V 300W * Dimension (WxDxH): 12.2 x 15.7 x 3.6 inch / 310 x 400 x 92 mm
In-Win BT610T, Black Slim Desktop, 1x 5.25"/1x 3.5" Ext + 1x 3.5" Int Bays, 300W P.S
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Specifications * Mfr Part Number: BT610T.300BL * Color: Black * Case Size: Desktop/Tower Slim PC Chassis * M/B Form Factor: mATX * Drive Bays: o External: 5.25" x 1, 3.5" x 1 o Internal: 3.5" x 1 * CPU Type: Intel P4 & Prescott(3.6GHz); AMD Athlon * Power Supply: 300W, TFX 12V form factor * I/O Expansion Slots: 4x Low-profile PCI/AGP Expansion Slots * Dimension (HxWxD): 92 x 310 x 400 mm / 3.6 x 12.2 x 15.7 inch
In-Win BT611T, Silver Mini-Desktop, 1x 5.25"/1x 3.5" Ext + 1x 3.5" Int Bays, 300W P.S
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Specification * Mfr Part Number: BT611T.300SL * Case Type: Mini Desktop * Color: Silver/Black * Material: 0.8mm Best Performed SECC Japanese Steel metal * M/B Type: M-ATX * Drive Bays: 3 o External Bay: 1x 5.25"; 1x 3.5" o Internal Bay: 1x 3.5" * Expansion Slots: 4 (Low-profile) * Cooling System: 1x 80mm fan; Increased air duct * Side Windows: No * Front I/O Panel: 2x USB2.0 Ports; 1x Speaker; 1x Mic * Power Supply: 300W, TFX 12V * Dimensions (WxDxH): 12.2 x 17 x 3.6 inch / 310 x 432 x 92 mm
In-Win D500B, Black 2x 5.25"/1x 3.5" Ext+2x 3.5" Int Bays, 2x Front USB, 240W
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In-Win D500B, Black 2x 5.25"/1x 3.5" Ext+2x 3.5" Int Bays, 2x Front USB, 240W
In-Win D500G.240FU2AD P4 3G Standard Fan USB Audio Air Duct 240W
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Features: > Material: Best Performed SECC Japanese Steel metal. > 0.8 mm Sheet Metal Construction - for better stability & durability. > Detachable HDD Drive Cage - for better install and service > Folded Edge - for safety installation. No sharp edges, debris. . > Front Snap on Card Guide Cage - for optional extra 8cm auxiliary cooling fan, no screw required. Can generate better airflow for system, and hold PCI / AGP cards. (Optional fan is not included). > Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. > Extra Vent at Rear Panel - optional 6cm auxiliary cooling fan can be installed with standard fan hold screws at rear panel for better system cooling. (Optional fan is not included). > Meet CE, FCC Class B requirements. > Rail Construction for 5.25"/3.5" device for faster installation and service.
In-Win D500T.240FU2AD P4 3G Standard Fan USB Audio Air Duct 240W
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In-Win Mt.Jade-BK623, Black Desktop, 1x 5.25"/1x 3.5" Ext + 1x 3.5" Int Bays, 300W P.S
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Specification * Mfr Part Number: IW-MTJADE.GLS300 * Case Type: Tiny Tower/Desktop * Color: Black * Material: 0.6mm SECC Japanese ECO Steel * M/B Type: Micro ATX * Processor: Perfect for Core 2 Duo / Core 2 Quad * Drive Bays: 3 o External Bay: 1x 5.25", 1x 3.5" o Internal Bay: 1x 3.5" * Expansion Slots: 4 (Full Height) * Cooling System: None * Side Windows: No * Front I/O Panel: 4x USB 2.0 Ports; 1x IEEE 1394 Port; 1x HD Audio * Power Supply: 300W, SFX 12V Form Factor * Dimensions: 12.7 x 5.5 x 10.8 inch / 323 x 140 x 276 mm
In-Win R400, Black 4U RM, 3x 5.25"/2x 3.5" Ext + 3x 3.5" Int Bays, 350W P.S
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Specification * Mfr Part Number: IW-R400 * Features: o Less vibration issue o Superior cooling through front air intake o Single or Redundant power supply option o Front door with lockable for data security o Tool-less design for easy installation & lower maintenance cost * Case Type: 4U Rackmount * Material: 1.2mm SGCC * Color: Black * M/B Type: ATX, 12 x 9.6 inch; CEB, 12 x 10.5 inch * CPU Type: Up P4, DP Opteron, DP Xeon * Drive Bays: 8 o External Bay: 3x 5.25"; 2x 3.5" o Internal Bay: 3x 3.5" * Expansion Slots: 7 * Cooling System: 1x 120x25mm front fan, Optional 2x 80x25mm optional rear fans (easy-swap) * Side Windows: No * Front I/O Panel: 2x USB ports * Power Supply: None * Dimensions (WxDxH): 19 x 20 x 7 inch / 482.6 x 508 x 177.8 mm * Weight: 27 lbs / 12.3 kg
In-Win S523T.430BFU2BD CAG1.0 3 2(2)Bays Fan USB2.0 430W
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Features: > Best Performed SECC Japanese Steel metal. > Rail Construction for 5.25"/3.5" device -(2*5.25,2*3.5) for faster installation and service. > Detachable HDD Drive Cage - for better install and service. > Folded Edge - for safety installation. No sharp edges, debris. > Extra Vent at Rear Panel - optional 8cm or 9cm auxiliary cooling fan can be installed at rear panel for better system cooling. (Optional fan is not included) > Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. > Screwless Front Panel & Side Panels - for easy removal and installation. > Configured 7 drive bays - (3 x 5.25", 4x3.5") drive bays for expandability of future upgrade. > 0.8 mm Sheet Metal Construction - for better stability & durability. > Meet CE, FCC Class B requirement.
In-Win V523G.I250FU2D Mid ATX 2 2(1) USB2.0 TAC1.0 250W
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Features: > Best Performed SECC Japanese Steel metal. > Detachable HDD Drive Cage - for better install and service. > Extra Vent at Rear Panel - optional 8cm auxiliary cooling fan can be installed at rear panel for better system cooling. (Optional fan is not included). > Folded Edge - for safety installation. No sharp edges, debris. > Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. > Configured 5 Drive Bays - (2 x 5.25", 3x3.5") drive bays for expandability of future upgrade. > 0.8 mm Sheet Metal Construction - for better stability & durability. > Screwless Front Panel - for easy removal and installation. > Meet CE, FCC Class B requirement.
In-Win V564G.I250BFD.I530 Micro ATX P4 USB 1394 Fan Card Reader
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Features: > Best Performed SECC Japanese Steel metal. > Detachable HDD Drive Cage - for better install and service. > Extra Vent at Rear Panel - optional 8cm auxiliary cooling fan can be installed at rear panel for better system cooling. (Optional fan is not included). > Folded Edge - for safety installation. No sharp edges, debris. > Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. > Configured 5 Drive Bays - (2 x 5.25", 3x3.5") drive bays for expandability of future upgrade. > 0.8 mm Sheet Metal Construction - for better stability & durability. > Screwless Front Panel - for easy removal and installation. > Meet CE, FCC Class B requirement.
In-Win Z720T.I300BFU2AD Micro ATX TAC1.1 Prescott USB SATA 300W
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Features: > Best Performed SECC Japanese Steel metal. > 0.8 mm Sheet Metal Construction - for better stability & durability. > Extra Vent at Rear Panel - optional 8cm auxiliary cooling fan can be installed at rear panel for better system cooling. (Optional fan is not included). > Folded Edge - for safety installation. No sharp edges, debris. > Stamped Motherboard Support - no M/B standoffs installation required, for faster M/B installation. > Configured 4 Drive Bays - (2 x 5.25", 2x3.5") drive bays for expandability of future upgrade. > Meet CE, FCC Class B requirement.
InRow RD and Air Cooled
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InRow RD, 300mm, Air Cooled, 220-240V, 50Hz
InfraStruXure 20kW, 208V
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InfraStruXure fully integrates power, cooling, and environmental management within a rack-optimized design. The InfraStruXure on-line BuildOut Tool automates the process of designing the optimum system. These customized systems are then built from standardized components which are modular, manageable, and pre-engineered to work together. This modular flexibility enables you to install only what is required today, yet easily scale to meet future demands. InfraStruXure increases system availability while decreasing design and install time from months to days, while eliminating the need for raised floors in many applications. This InfraStruXure 20kW, 208V System is an On-demand architecture for Network-critical Physical Infrastructure in small data centers containing 5 - 20 racks.
InfraStruXure PDU 80kW
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APC's InfraStruXure PDU can be designed, implemented, and maintained to exactly meet your requirements for high availability, quick cycle time, and lower cost of ownership.
Intel 600P, 128GB, M.2/80mm PCI-e SSD(TLC)
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Intel 600P, 128GB, M.2/80mm PCI-e SSD(TLC)
Intel 600P, 1TB, M.2/80mm PCI-e SSD(TLC)
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Intel 600P, 1TB, M.2/80mm PCI-e SSD(TLC)
Intel 600P, 256GB, M.2/80mm PCI-e SSD(TLC)
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Intel 600P, 256GB, M.2/80mm PCI-e SSD(TLC)
Intel 600P, 512GB, M.2/80mm PCI-e SSD(TLC)
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Intel 600P, 512GB, M.2/80mm PCI-e SSD(TLC)
Intel 660p, 1TB, M.2/80mm PCI-e3.0 NVMe SSD(QLC)
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Mfr Part Number: SSDPEKNW010T8X1 ¿Capacity: 1.0TB ¿Form Factor: M.2 22 x 80 mm ¿Interface: PCI-Express NVMe 3.0 x4 ¿NAND Flash: QLC ¿IOPS:◦Random Read (8GB Span): Up to 150,000 IOPS ◦Random Write (8GB Span): Up to 220,000 IOPS ¿Bandwidth:◦Sequential Read: Up to 1800 MB/s ◦Sequential Write: Up to 1800 MB/s ¿Vibration:◦Operating: 2.17 GRMS ◦Non-operating: 3.13 GRMS ¿Shock: ◦Operating: 1000G ◦Non-operating: 1000G ¿MTBF: >= 1.6 million hours ¿Power Consumption:◦Active: 0.1 W ◦Idle: 0.04 W ¿Weight: <10.0 g