Super X13DAI-T,4th Gen 2x LGA-4677,6x PCI5.0,VGA,HD Audio 7.1,2x 10G LAN,10x SATA3,4xNVMe,DDR5(4TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP Support CXL Intel® C741 Chipset Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots Broadcom BCM57416 Dual ports 10G LAN 4 PCIe 5.0 x16 2 PCIe 5.0 x8 2 SATA DOM ports 2 M.2 4 NVMe ports PCIe 5.0 x4 via 2 MCIO connectors HD Audio 7.1 8 SATA 3.0 ports(C741) 1 USB 3.2 Gen 2, 8 USB3.2 Gen 1 and 1 USB 2.0
Super X13DEI,4th Gen 2x LGA-4677,6x PCI5.0, VGA, 2x GB LAN, 10x SATA3+R,2x M.2+2x SDOM,IPMI,D5(4TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP Support CXL Intel® C741 Chipset Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots 4 PCIe 5.0 x16 2 PCIe 5.0 x8 Broadcom BCM57416 Dual ports 1G LAN 6 USB3.0 and 3 USB2.0 2 SATA DOM ports 2 M.2 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors 8 SATA3.0 ports
Super X13DEI-T,4th Gen 2x LGA-4677,6x PCI5.0,VGA,2x 10G LAN,10x SATA3+R,2x M.2+2x SDOM,IPMI,D5(4TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Dual Socket LGA-4677 (Socket E) , CPU TDP supports up to 350W TDP Support CXL Intel® C741 Chipset Up to 4TB 3DS ECC RDIMM, DDR5-4800MT/s(1DPC) in 16 DIMM slots 4 PCIe 5.0 x16 2 PCIe 5.0 x8 Broadcom BCM57416 Dual ports 10G LAN 6 USB3.0 and 3 USB2.0 2 SATA DOM ports 2 M.2 6 NVMe ports PCIe 5.0 x4 via 3 MCIO connectors 8 SATA3.0 ports
Super X13SEI-F, 4th Gen 1x LGA-4677, 5x PCI5.0, VGA, 2x GB/i210, 10x SATA3, 4x NVMe, IPMI, DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16, M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 1GbE with Intel® I210 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEI-TF, 4th Gen 1x LGA-4677, 5x PCI5.0, VGA, 2x 10GB/X550, 10x SATA3,4x NVMe,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E), CPU TDP supports up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 2 MCIO (PCIe5.0 x8) connectors for 4 NVMe SSDs 3 PCIe 5.0 x8, 2 PCIe 5.0 x16, M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 10GbE with Intel® X550 4 USB 3.2 Gen1 (2 rear, 1 Type-A, 1 via header), 2 USB 2.0 (2 rear) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEM-F, 4th Gen 1x LGA-4677, 3x PCI5.0, VGA, 2x GB/i350, 10x SATA3, 4x NVMe, IPMI, DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s) M.2 Interface: 2 PCIe 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors Dual LAN with 1GbE with Intel® I350 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports
Super X13SEM-TF, 4th Gen 1x LGA-4677, 3x PCI5.0,VGA,2x 10GB/X550,10x SATA3,4x NVMe,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s) M.2 Interface: 2 PCIe 4.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors Dual LAN with 10GBase-T with Intel® X550 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers) Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports
Super X13SEW-F,4th Gen 1x LGA-4677, WIO,2x PCI5.0,VGA,2xGB/i210,10xSATA3,10xNVMe,M.2,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8 ( in x16) 1 PCIe 5.0 x32 M.2 Interface: 1 PCIe 3.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors Dual LAN with 1GbE with Intel® I210 2 SuperDOM with built-in power I/O: 1 VGA, 2 COM, 1 TPM header 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SEW-TF,4th Gen 1x LGA-4677,WIO,2x PCI5.0,VGA,2x10GB/X550,10xSATA310xNVMe,M.2,IPMI,DDR5(2TB)
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Key Features 4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8 ( in x16) 1 PCIe 5.0 x32 M.2 Interface: 1 PCIe 3.0 x2 M.2 Form Factor: 2280, 22110 M.2 Key: M-Key 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors Dual LAN with 10GBase-T with Intel® X550 2 SuperDOM with built-in power I/O: 1 VGA, 2 COM, 1 TPM header 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A) Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Super X13SRA-TF,W-2400 & W3400/LGA-4677,3xPCI5.0,VGA,HD Audio,1xGB+1x10GB,6xSATA3+R,2xM.2+R,D5(2TB)
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Key Features Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, TDP up to 350W Intel® W790 Up to 2TB RDIMM 3DS, 512GB ECC RDIMM; DDR5-4800MT/s (1DPC)/4400MT/s (2DPC), in 8 DIMM slots 3 PCIe 5.0 x16 Slots, support up to 3 Single Width/2 Double Width/2 Triple Width GPU cards 1 PCIe 4.0 x4 Slots M.2 Interface: 2 PCIe 5.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Socket (w/o heat sink) 1GbE LAN port with Intel® Ethernet Controller I210-AT
Super X13SWA-TF,W-2400&W3400/LGA-4677,6xPCIe5,VGA,HD Audio,1xGB+1x10GB,8xSATA+R,2xM.2+R,IPMI,D5(2TB)
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Key Features Intel® Xeon® W-3400 series and Xeon® W-2400 series processors, Up to 350W TDP Intel® W790 Up to 4TB(W-3400)/2TB(W-2400) 3DS ECC RDIMM, 1TB(W-3400)/512GB(W-2400) ECC RDIMM; DDR5-4800MT/s(1DPC)/ 4400MT/s(2DPC), in 16 DIMM slots M.2 Interface: 4 PCIe 5.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Socket (w/o heat sink) Xeon® W-3400 Series Processors: 6 PCIe 5.0 x16 Slots, support up to 6 Single Width/4 Double Width/2 Triple Width GPU cards Xeon® W-2400 Series Processors:3 PCIe 5.0 x16 Slots, support up to 3 Single Width/3 Double Width/2 Triple Width GPU cards (slot 3/5/7)