Product Overview
Key Features 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB¿ ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 16x DIMM slots 4. 1x PCI-E 3.0 x32 Left riser slot 1x PCI-E 3.0 x8 Right riser slot 1x PCI-E 3.0 x8 for Add-On-Module 5. Intel® i350 Dual port Gigabit Ethernet 6. 10x SATA3 (6Gbps); RAID 0, 1, 5, 10 7. Integrated IPMI 2.0 and KVM with Dedicated LAN 8. 3x USB 3.0 (2 rear, 1 Type A); 4x USB 2.0 (2 rear, 2 via header)
Specifications
MBD
X10DDW-i
PCI-Express
1x PCI-E 3.0 x8 for Add-on Module 1x PCI-E 3.0 x24 - Left riser slot 1x PCI-E 3.0 x8 - Right riser slot
Physical Stats
Form Factor Proprietary WIO Dimensions 12.8" x 13.4" (32.5cm x 34.0cm)
Processor
Intel® Xeon® processor E5-2600 v3 family (up to 145W TDP **)
Memory Capacity
16x 288-pin DDR4 DIMM sockets Up to 1TB ECC LRDIMM, 512GB ECC RDIMM
Memory Type
2133/1866/1600MHz ECC DDR4 SDRAM 72-bit RDIMM: 32GB, 16GB, 8GB, 4GB LRDIMM: 64GB, 32GB
Chipset
Intel® C612 Express chipset
SATA
10x SATA3 (6Gbps);
Network Controllers
Intel® i350 Dual Port Gigabit Ethernet Virtual Machine Device Queues reduce I/O overhead Supports 10Base-T, 100BASE-TX, and 1000BASE-T, RJ45 output
