Product Overview
Key Features 1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4/ v3 and E5-1600 v3 family 2. Intel® C612 chipset 3. Up to 1TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 8x DIMM slots 4. Expansion slots: 1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot 5. Intel® i350-AM2 Dual port GbE LAN 6. 10x SATA3 (6Gbps) via C612 7. 1x VGA, 2x COM, 1x TPM 8. 4x USB 3.0 ports, 8x USB 2.0 ports 9. 2x SuperDOM with built-in power
Specifications
MBD
X10SRW-F
Physical Stats
Dimensions 8.15" x 13.05", (20.70cm x 33.15cm)
Processor
Intel® Xeon® processor E5-2600/1600 v3 family (up to 145W TDP **)
Memory Capacity
8x 284-pin DDR4 DIMM sockets Up to 512GB DDR4 ECC LRDIMM Up to 256GB DDR4 ECC RDIMM
Memory Type
2133/1866/1600/1333MHz ECC DDR4 SDRAM 72-bit, 284-pin gold-plated DIMMs DIMM Sizes: RDIMM: 32GB, 16GB, 8GB, 4GB
Chipset
Intel C612 Express chipset
IPMI
Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2400 BMC
PCI-Express
1x PCI-E 3.0 x8 (in x16) slots 1x PCI-E 3.0 x32 Left Riser slot
SATA
SATA3 (6Gbps) via C612 controller RAID 0, 1, 10 support
