Product Overview
Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported Intel® C621 Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVMExpress x4 Internal Port(s) 1 VGA port Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Dual LAN with GbE from C621
Specifications
MBD
X11DPi-N
PCI-Express
4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8
Physical Stats
E-ATX, 12" x 13" (30.48cm x 33.02cm)
Processor
Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Cores / Cache
Up to 28 cores
Memory Type
2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 64GB, LRDIMM: 128GB, 3DS LRDIMM: 128GB
Memory Voltage
1.2V
Chipset
Intel® C621
M.2
M.2 Interface: PCI-E 3.0 x4 Form Factor: 2260, 2280, 22110 Key: M-Key
SATA
Intel® C621 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Network Controllers
Dual LAN with GbE from C621
LAN
2 RJ45 Gigabit Ethernet LAN ports
USB
4 USB 2.0 ports (2 rear + 2 headers), 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output
1 VGA port
