Product Overview
Key Features Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s Intel® C622 Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 22110 M.2 Key: M-Key (RAID 0,1 support) 1 VGA port Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Specifications
MBD
X11DPH-T
PCI-Express
3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
Physical Stats
E-ATX, 12" x 13" (30.48cm x 33.02cm)
Processor
Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
Memory Capacity
Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
Memory Type
2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
RDIMM: 64GB, LRDIMM: 64GB, 3DS LRDIMM: 128GB
Memory Voltage
1.2V
Chipset
Intel® C622
M.2
M.2 Interface: 2 PCI-E 3.0 x4 Form Factor: 2242/2260/2280/22110 Key: M-Key (RAID 0,1 support)
SATA
Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Network Controllers
Dual LAN with 10GBase-T with Intel® X55
LAN
2 RJ45 10GBase-T ports
USB
7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
Video Output
1 VGA port
